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No Clean Flux

Providing you the best range of low solids no clean flux, no clean soldering flux and no clean flux with effective & timely delivery.

Low Solids No Clean Flux

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Low Solids No Clean Flux
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Product Details:
Material TypeChemical
Material Melting Temperature280 c
Material FormLiquid

Keeping the track of latest happening of this domain, we present the optimum quality of Low Solids No Clean Flux. The low solids no clean flux is free from halogen, non-corrosive and tack-free residue. Besides this, the rendered low solids no clean flux is very stable foaming characteristics. The quality of the low solids no clean flux is never compromised.

Features:

  • Safe residue.
  • High S.I.R. value
  • Excellent soldering finish can be obtained with no occurrence of solder

Merits Of Using DDV-2E No Clean Flux:


  • Halogen / RoHS free
  • Non-corrosive and tack-free residue
  • Reduced odour associated with soldering process
  • Very easy to use
  • Very economical
  • Eliminate the need expense of cleaning
  • Very stable foaming characteristics
  • Safe residue
  • High S.I.R. value
  • Excellent soldering finish can be obtained with no occurrence of solder balling, bridge formation, icicles, etc
  • Board probing after soldering can be easily done without cleaning
  • No switch contact problems
  • No blockage to spray nozzle

Application:

  • DDV-2E no clean flux is applicable in any of the existing wave soldering machine used in the industry today. Application of the flux can be any of the three methods: Dip, Wave and Foam
  • Preheat temperature of between 850 C and 1050 C on the component side of the board is recommended
  • For best foaming result, the level of flux in the fluxing tank should be maintained at about 1.3 to 2.0 cm above the foaming stone
  • Periodic monitoring of specific gravity with a hydrometer or automatic density censoring systems and addition of the appropriate amount of flux thinner is necessary to ascertain consistent soldering results.


Additional Information:

  • Item Code: DDV-2E
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No Clean Soldering Flux

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No Clean Soldering Flux
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Product Details:
Material TypeLquid flux
Material Melting Temperature280 c
Material Compositionsoldering flux

Motivated to attain maximum client approval, we present the optimum quality of No Clean Soldering Flux. Processed by using latest technology, the offered no clean flux is used for wave soldering for both conventional through hole. Easy to use and compositional accuracy makes the no clean flux highly demanded in the market.

Features:


  • Reduced odor associated with soldering process
  • Very stable foaming characteristics
  • Halogen free

Merits Of Using SS-9001 No Clean Flux:


  • Halogen free
  • Non-corrosive and tack-free residue
  • Reduced Odour associated with soldering process
  • Very easy to use
  • Very economical
  • Eliminate the need and expense of cleaning
  • Very stable foaming characteristics
  • Safe residue
  • High S.I.R. value
  • Excellent soldering finish can be obtained with no occurrence of solder balling, bridge formation, icicles etc
  • Board probing after soldering can be easily done without cleaning
  • No switch contact problem


Additional Information:

  • Item Code: SS-9001
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No Clean Flux

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No Clean Flux
Ask for Price

Thanks for Contacting Us.

Product Price :Get Latest Price

Product Details:
Material Typelight yellow sticky liquid
Material Melting Temperature280 c

As the first among the best, we present the clients with the superior quality of No Clean Flux. Free from halogen, the offered no clean flux is used for the purpose of wave soldering for both conventional through hole. As a quality focused name, the premium grade of no clean flux is never compromised and is maintained in accordance to the international set standards.

Features:

  • Non-corrosive and tack-free residue
  • Reduced Odor associated with soldering process
  • Very easy to use

Merits Of Using SS-7003 Rf No Clean Flux:


  • Halogen free
  • Non-corrosive and tack-free residue
  • Reduced odour associated with soldering process
  • Very easy to use
  • Very economical
  • Eliminate the need and expense of cleaning
  • Very stable foaming characteristics
  • Safe residue
  • High S.I.R. value
  • Excellent soldering finish can be obtained with no occurrence of solder balling, bridge formation, icicles etc
  • Board probing after soldering can be easily done without cleaning
  • No switch contact problems
  • No blockage to spray nozzle


Additional Information:

  • Item Code: SS-7003RF
Send Bulk Enquiry

 
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Gunvant Padalsekar (Owner)
Shree Swaminarayan Industries
Plot No. PAP-G-8/9, MIDC, Phase III, Near Mercedeze Benz, Chakan, Tal. Khed
Pune - 410501, Maharashtra, India
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